There are numerousreasons why components fail.
These causes can be prevented by anticipating these common factors and adjusting the design accordingly.
Mechanical failures are only one cause of package failures.
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The result is brittle layers called intermetallic layers.
These layers lead to broken solder joints and often elude early detection.
Tin whiskers on lead-free solders can also be a problem.
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Tin whiskers grow out of lead-free solder joints that can bridge contacts or break off and cause shorts.
The soldering and operational environment of a PCB often leads to a variety of failures over time.
